Packages
Following the trend toward ever more advanced and compact electronic devices, packaging technologies for high-destiny implementation of highly integrated, high-speed ASIC chips have become increasingly important. Consequently Epson provides a broad lineup of packages to meet customers'diverse packaging needs for chips with widely ranging lead counts and geometries.
Gate Array Package List
Package Lineup
QFP&TQFP
| Pin Count |
Mold Shape |
Lead Pitch(mm) |
Lead Type |
Material |
Body Size(mm) |
Thickness Max |
| 48 |
TQFP12 |
0.5 |
STD |
Cu |
7×7 |
1.2 |
| 48 |
QFP12 |
0.5 |
STD |
Cu |
7×7 |
1.7 |
| 64 |
TQFP13 |
0.5 |
STD |
Cu |
10×10 |
1.2 |
| 64 |
QFP13 |
0.5 |
STD |
Cu |
10×10 |
1.7 |
| 80 |
QFP14 |
0.5 |
STD |
Cu |
12×12 |
1.7 |
| 100 |
TQFP15 |
0.5 |
STD |
Cu |
14×14 |
1.2 |
| 100 |
QFP15 |
0.5 |
STD |
Cu |
14×14 |
1.7 |
| 128 |
TQFP15 |
0.4 |
STD |
Cu |
14×14 |
1.2 |
| 128 |
QFP15 |
0.4 |
STD |
Cu |
14×14 |
1.7 |
| 144 |
QFP20 |
0.5 |
STD |
Cu |
20×20 |
1.7 |
| 176 |
QFP21 |
0.5 |
STD |
Cu |
24×24 |
1.7 |
| 208 |
QFP22 |
0.5 |
STD |
Cu |
28×28 |
1.7 |
| 216 |
QFP21 |
0.4 |
STD |
Cu |
24×24 |
1.7 |
| 256 |
QFP22 |
0.4 |
STD |
Cu |
28×28 |
1.7 |
SQFN (Saw Quad Flat Non-leaded Package)
| Pin Count |
Mold Shape |
Lead Pitch(mm) |
Lead Type |
Material |
Body Size(mm) |
| 24 |
SQFN 4 |
0.5 |
STD |
Cu |
4×4×1.0 |
| 32 |
SQFN 5 |
0.5 |
STD |
Cu |
5×5×1.0 |
| 48 |
SQFN 7 |
0.5 |
STD |
Cu |
7×7×1.0 |
| 64 |
SQFN 9 |
0.5 |
STD |
Cu |
9×9×1.0 |
WCSP (Wafer level Chip Scalce Package)
| Pin Count |
Mold Shape |
Ball Pitch(mm) |
Body Size(mm) |
| 16 |
WCSP(S1L5012) |
0.5 |
2.4×2.4×0.8 |
| 25 |
WCSP(S1L5028) |
0.5 |
3.1×3.1×0.8 |
| 49 |
WCSP(S1L5075) |
0.5 |
4.2×4.2×0.8 |
| 81 |
WCSP(S1L5125) |
0.5 |
5.0×5.0×0.8 |
| 49 |
WCSP(S1L60093) |
0.4 |
3.0×3.0×0.8 |
PFBGA (Plastic Fine-pitch Ball Grid Array)
| Mold Shape |
Body Size(mm) |
Ball Pitch(mm) |
| PFBGA5U-60 |
5×5×1.2 |
0.5 |
| PFBGA5U-81 |
5×5×1.2 |
0.5 |
| PFBGA6U-96 |
6×6×1.2 |
0.5 |
| PFBGA6U-121 |
6×6×1.2 |
0.5 |
| PFBGA7U-144 |
7×7×1.2 |
0.5 |
| PFBGA7U-161 |
7×7×1.2 |
0.5 |
| PFBGA8U-161 |
8×8×1.2 |
0.5 |
| PFBGA8U-181 |
8×8×1.2 |
0.5 |
| PFBGA7U-100 |
7×7×1.2 |
0.65 |
| PFBGA8U-112 |
8×8×1.2 |
0.65 |
| PFBGA8U-121 |
8×8×1.2 |
0.65 |
| PFBGA10U-160 |
10×10×1.2 |
0.65 |
| PFBGA10U-180 |
10×10×1.2 |
0.65 |
| PFBGA12U-208 |
12×12×1.2 |
0.65 |
| PFBGA7U-48 |
7×7×1.2 |
0.8 |
| PFBGA8U-81 |
8×8×1.2 |
0.8 |
| PFBGA10U-121 |
10×10×1.2 |
0.8 |
| PFBGA10U-144 |
10×10×1.2 |
0.8 |
| PFBGA12U-180 |
12×12×1.2 |
0.8 |
| PFBGA14U-220 |
14×14×1.2 |
0.8 |
| PFBGA16U-280 |
16×16×1.2 |
0.8 |
VFBGA (Very Thin Fine-pitch Ball Grid Array)
| Mold Shape |
Body Size(mm) |
Ball Pitch(mm) |
| VFBGA4H-49 |
4×4×1.0 |
0.5 |
| VFBGA5H-81 |
5×5×1.0 |
0.5 |
| VFBGA6H-96 |
6×6×1.0 |
0.5 |
| VFBGA6H-121 |
6×6×1.0 |
0.5 |
| VFBGA7H-144 |
7×7×1.0 |
0.5 |
| VFBGA7H-161 |
7×7×1.0 |
0.5 |
| VFBGA8H-181 |
8×8×1.0 |
0.5 |
| VFBGA10H-240 |
10×10×1.0 |
0.5 |
| VFBGA10H-121 |
10×10×1.0 |
0.8 |
| VFBGA10H-144 |
10×10×1.0 |
0.8 |
