Package Lineup
From this web page, you can get package product information, such as package shapes and dimensions, cautions that need to be exercised at the time of assembly, and chemical substances in products.
* Some of these packages have WCSP product. For more information, please contact your Epson sales representative.
Information on Substances of Very High Concern in our products
About the details of our IC products, please click here.
(84KB)
About the RoHS Compliance Information of our IC package products, please click the following link.
Eu-RoHS Compliance (package)
(69KB)
China-RoHS Compliance
(181KB)
About the RoHS Compliance Information of our IC Chip products, please click the following link.
Eu-RoHS Compliance (die)
(39KB)
China-RoHS Compliance(die)
(80KB)
PFBGA (Plastic Fine-pitch Ball Grid Array)
VFBGA (Very Thin Fine-pitch Ball Grid Array)
PBGA (Plastic Ball Grid Array)
| Pin | Ball pitch |
Mounting height (Max.) |
Epson package name (JEITA package name) |
Package diagram |
Reflow profile | Ecology Profile |
|---|---|---|---|---|---|---|
| 256 | 1 | 1.7 | PBGA1UE256 (P-LBGA-0256-1717-1.00) |
|
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