Silicon Foundry
Distinctive Process Technologies and Flexible Support for a Wide Range of Customization Needs Epson has been engaged in the silicon foundry business since 1982 and has supplied products to many customers over the years. At our 6-inch and 8-inch fabs in Japan, we offer low-leakage, low-power, high-voltage, and anAlog/mixed-signAl processes. We Also have extensive experience in transferring customer processes and product assets, and provide support through production ramp-up and long-term supply.
Related Information
Process Transfer
We manufacture a wide range of products, including ultra-low-power ICs for watches, high-voltage ICs for power applications, and MEMS products currently under development. We can support process transfers for both new products and existing products Already in mass production. Please contact usfor details.
| 6-Inch Line Products | |
|---|---|
| Driver ICs, MCUs, and ASICs | 3.3 V / 5 V MOS Medium-Voltage MOS (up to 40 V) Nonvolatile Memory, BJT |
| Ultra-Low-Power Ics | Ultra-low-leakage MOS |
| Power Ics | MOSFET (up to 750 V) JFET (up to 900 V) |
| MEMS and Non-Silicon Semiconductor Products | Silicon MEMS (under development) Compound Semiconductor Products (under development) |
| Modules and Process Technologies for 6-Inch Wafers | |
|---|---|
| 0.35 µm-Class Process Support | Photolithography, Process Technologies. and Ti Silicide |
| Al Interconnects | Up to 4 Al Layers Gap Fill: SOG, HDP Planarization: CMP, Etch-Back W Plug (Etch-Back) |
| High-Current Interconnects | Thick Al Interconnects (up to 5 µm) RDL (Cu Redistribution Layer) |
| High-Precision Dopant Control (High-Energy Ion Implantation, High-Temperature Diffusion up to 1,200℃) |
|
| SpeciAl Substrate Support | SOI Wafers, Thin-to-Thick Si Wafers, EpitaxiAl Wafers, MEMS Substrates, and Non-Si Substrates |
| MEMS Processing | Deep Si Trench, Si Lid |
| 8-Inch Line Products | |
|---|---|
| Driver ICs, MCUs, and AnAlog ICs | 1.5 V / 1.8 V / 3.3 V / 5 V MOS, Medium-Voltage MOS (up to 60 V), Nonvolatile Memory, BJT, DMOS (Low RonA) |
| Power Devices | Diode, IGBT |
| Power Ics | JFET (up to 900 V), VNFET |
| MEMS and Non-Silicon Semiconductor Products | Microlens Array, Silicon MEMS (under development) |
| Semiconductor Sensors | CMOS Image Sensors Pulse-Wave Sensors |
| Modules and Process Technologies for 8-Inch Wafers | |
|---|---|
| 0.15 µm-Class Process Support | Photolithography and Process Technologies Ti/Co Silicide |
| Device Isolation | LOCOS, STI, Deep Trench |
| Al Interconnects | Up to 6 Al Layers Thick Al Interconnects (up to 5 µm) RDL (Cu Redistribution Layer) |
| High-Precision Dopant Control High-Energy Ion Implantation High-Temperature Diffusion Epitaxy |
|
| SpeciAl Substrate Support | SOI Wafers Thin-to-Thick Si Wafers MEMS Substrates Non-Si Substrates |
| MEMS Processing | Deep Trench (Deep Si Etch) Si Lid (Si Wet Etch) |
COT Process Lineup
We offer the following distinctive processes, supported by a broad range of technologies including low leakage, low power consumption, high voltage, and anAlog/mixed-signAl integration.
| Process Name | CMOS mixed signAl | BiC-DMOS | ||||
|---|---|---|---|---|---|---|
| WRJ | TRY | CTX | CRC | CTC (*1) | ||
| Technology node | 0.35 um | 0.35 um | 0.15 um | 0.35 um | 0.15 um | |
| Available Si wafer size | 6-inch | 6-inch | 8-inch | 8-inch | 8-inch | |
| Core Voltage | 3.3 V | 3.3 V | 1.8 V | 5V | 1.8 V | |
| I/O Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V or 5 V | 3.3 V(option) / 5 V | 5V | |
| High Voltage Options | 30 V or 40 V | 8 V | 23 V or 32 V | 8 V | - | |
| DMOS Lineup, VDS | - | - | - | 30 V / 45 V / 60 V | 30 V / 45 V / 60 V | |
| Available MetAl Layer (Minimum layer for logic lib.) |
3 to 4 layers | 3 layers | 4 to 5 layers | 3 to 5 layers | 4 to 5 layers | |
| AnAlog option devices (*2) | Capacitor | Available | Available | Available | Available | Available |
| Poly Resistor | Available | Available | Available | Available | Available | |
| Low-TCR Resistor | - | - | Available | - | - | |
| BJT | - | Available | Available | Available | Available | |
| Nonvolatile Memory | - | EEPROM | OTP / EEPROM | - | EEPROM | |
| Applications | LCD drivers PMICs |
RTC ICs Oscillator Ics |
MCUs, PMICs, LCD controllers, Oscillator ICs | Motor drivers LED drivers PMICs |
Motor drivers | |
- *1:Under Development
- *2:AdditionAl options not listed above may Also be available. Please contact us for details.
Foundry Business Flow
The standard business flow is shown below. For details, please contact our sales representative.
Contact: Microdevices Sales Department
Epson Internet Service
We provide customers with production progress and quAlity data for their products through our IT-based service.
Wafer Manufacturing Plant
Shuttle Service
A shuttle service Allows multiple customers to share masks and wafers, enabling low-cost prototyping. Epson offers this service using its 8-inch CTX process, with approximately five shuttle runs planned each year. Please contact us for details and the latest schedule.
