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Quality Management System certification

Epson quickly began working to acquire company-wide ISO certification. Electronic Devices; Semiconductor has acquired ISO9001 and ISO/TS16949 certification with its IC, module and their application products.

ISO9001

Type of certification ISO9001: 2008 , JIS Q 9001: 2008
Awarded to Semiconductor Operations Fujimi Plant, Hino Office, Suwa Minami Plant, Tohoku Epson Corp.
Certified by Bureau Veritas Japan Co., Ltd.
Certificate No. A3124795
Initial Date of Certification October 10, 1993
Date of expiration December 10, 2016
ISO9001 certificate (Sakata, Fujimi, Hino, Suwa-minami) PDF
(1,2MB)
Type of certification ISO9001: 2008
Awarded to Singapore Epson Industrial Pte. Ltd.
Certified by SGS
Certificate No. SG03/00011
Date of certification February 4, 2003
Date of expiration April 27, 2016
ISO9001 certificate
(SEP)
PDF
(1,6MB)

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ISO/TS16949

Type of certification ISO/TS16949:2009 -Third Edition
Awarded to TOHOKU EPSON Corp, SEIKO EPSON CORPORATION Fujimi Plant, Hino Office,EPSON EUROPE ELECTRONICS GmbH
Certified by Bureau Veritas Certification Holding.
Certificate No. 132828
Initial Date of Certification May 9, 2006
Date of expiration January 5, 2015
ISO/TS16949 certificate
(Sakata)
PDF
(743KB)
Type of certification ISO/TS16949:2009
Awarded to Singapore Epson Industrial Pte. Ltd.
Certified by SGS
Certificate No. SG07/00021
Date of certification June 7, 2007
Date of expiration April 27, 2016
ISO9001 certificate
(SEP)
PDF
(2MB)

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Note; Please scrap the pdf file or print of certificates properly when the date of expiration has passed.

ISO9001:
ISO9001 is an international standard for a product quality system that prescribes demands to the manufactures on a standpoint of customers.

ISO/TS16949:
ISO/TS16949 is an international standard of Quality management system for Automotive industry.


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IC Quality Assurance Handbook

Epson semiconductor product quality assurance guidebook PDF(780KB)

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Products Credibility Activities

We would set test item and sample depend on not only intended use or usage environment for devices also novelty and priority of products, then we would test reliability evaluation. We would curry out a environment test and mechanical test according to product type. The product specificity is considered in order to adapt various product type and the test condition is set accordingly.

Qualification Test items (example)

TEST ITEM TEST CONDITON TEST DURATION STANDARD
Temperature cycling
(TC)
-65°C to 150°C 200CYC.
  • EIAJ ED-4701 / 100 Test method 105
  • MIL-STD-883 1010
  • IEC 60749-25
High Temperature operating life
(HTOL)
125°C / Vdd-max 1000h
  • EIAJ ED-4701 / 100 Test method 101
  • MIL-STD-883 1005
  • IEC 60749-23
High Temperature humidity bias
(HTB)
85°C / 85%RH 1000h
  • EIAJ ED-4701 / 100 Test method 102
  • IEC 60749-5
High Temperature storage
(HTS)
150°C 1000h
  • EIAJ ED-4701 / 200 Test method 201
  • MIL-STD-883 1008
  • IEC 60749-6
Low temperature storage -65°C 1000h
  • EIAJ ED-4701 / 200 Test method 202
Pressure cooker
(Autoclave)
121°C / 2.0E5Pa 200h
  • EIAJ ED-4701 / 100 Test method 103
  • IEC 60749-33
Resistance to soldering heat Moisture soaking → reflow 3 Time
  • EIAJ ED-4701 / 300 Test method 301,302
  • IEC 60749-15
Resistance to solvent
(Permanence of marking)*1
IPA 1 Time
  • EIAJ ED-4701 / 500 Test method 501
  • MIL-STD-883 2015
  • IEC 60749-9

*1: Applies to ink mark only

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Mechanical Test items (example)

TEST ITEM TEST CONDITON TEST DURATION STANDARD
Thermal strength
(Pull test)
2.5N, 10 seconds 1 Time
  • EIAJ ED-4701 / 400 Test method 401
  • MIL-STD-883 2004
  • IEC 60749-14
Thermal strength
(Bending test)
90 degree bend 2 Time
  • EIAJ ED-4701 / 400 Test method 401
  • MIL-STD-883 2004
  • IEC 60749-14
Solderability 1 (Pb free) Steam Aging → solder dipping 4h → 245°C, 5seconds
  • EIAJ ED-4701/300 Test method 303
  • MIL-STD-883 2003
  • IEC 60749-21
Solderability 2 (Pb free) baking → solder dipping 150°C, 16h → 245°C, 5seconds
  • EIAJ ED-4701 / 300 Test method 303
  • MIL-STD-883 2003
  • IEC 60749-21

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ESD Test Procedure

With ICs miniaturization, obvious damages by ESD-Electrostatic-Discharge- are recognized. Epson would carry out ESD test in official standard and approve a product.



In order to determine the susceptibility levels of our device to ESD potential,testing in performed using the test circuit.

  1. After charging the condenser, switch the "SW" and apply the test voltage on each pins.
  2. Measure the all electrical parameters and the functions.
  3. If no failure is found, increase the voltage in steps. Continue testing until failure occurs.

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