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SEMICON Japan 2012

SEMICON Japan 2012 was held from December 5-7.
We would like to thank the many visitors to the Epson booth.
Photos from demonstrations of the products we had on display at the show are shown below. We are firmly committed to providing you with top-notch quality products and solutions that meet or exceed your expectations.

Introduction of Exhibit Products

Tri-temp IC test handler for high-speed 16-site testing (in development / reference exhibition)

Capable of simultaneously testing 16 sites in hot, cold, and room temperature environments, this handler provides the industry's highest throughput (UPH) at hot and cold temperatures. The handler uses an Epson handler change kit and is designed for faster jam recovery times during low-temperature measurements.

NX1032XS IC test handler


Tests up to 32 sites simultaneously
Equipped with a newly developed, high-performance hand, this handler provides among the highest throughputs (20,000 UPH) in the industry.
High temperature accuracy and free access were achieved by adopting an independent test hand heat press system.
This handler is capable of high-temperature testing of automotive devices as well as devices used in mobile terminals. With a wide socket area, it also supports simultaneous testing of a large number of RF devices.

Inkjet Marking System


  • Damage-free printing on thin wafers
  • Commandingly high throughput (25 or more 12-inch wafers/hour).
  • High visibility and readability
  • Capable of printing information on the back side of wafers and of marking bad dies on the front side of wafers

Scenes from the show