NX1032XS

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NX1032Xs

Features

  • Transfers, inspects and sorts up to 20,000 logic ICs every hour
  • 32-site simultaneous test capability.
  • Smart Motion Control robot control technology enables fast movement with low vibration when transferring semiconductors.

Main specifications

  NX1032XS
16-site 32-site
Device type QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3x3 to Max. 50x50 (Lead pitch: 0.4 mm or more)*1
Test mode - 32-site (8x4)
16-site (8x2)
8-site (4x2)
4-site (2x2)
4-site (4x1)
2-site (2x1)
Single
Testing area 344 mm x 146 mm 344 mm x 244 mm
Standard socket pitch (mm) X:40 Y:60
Heating method Heat press method
Index time 0.42 sec. (wide 4x2, 8x2 layout)*2
2.21 sec.(4,800N Option)*2
2.05 sec. (8x4 layout)*2
4.35 sec.(4,800N Option)*2
Min. 0.38 sec
Max. throughput(pcs/hour) 20,000 (Ambient), 10,500(high-temperature)
Binning Max. 6 bins (Auto 3, Manual 3)
Tray size JEDEC (135.9 x 315.0)mm
Hot plate size 220 x 380 mm 2pcs
Max. contact pressure 2,400 N (Standard) 4,800 N (otional)
Temperature accuracy +50degC to +90degC ±2degC
+90degC to +155degC ±3degC
Power requirement Single phase AC 200 to 240V 50/60 Hz 6kVA
Machine dimension (mm) 1,940(W) x 1,580(D) x 2,000(H)*3
Total weight Approx. 1,200 kg

*1 Depends on the socket size and socket pitch.
*2 Depends on the socket mounting height
*3 Excluding the handle, tower light, and LCD monitor