NS8000 Series

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new NS8160MS, NS8080MS, NS8080SH

The new IC test handlers boast significantly improved performance compared to Epson's NS-8000 series of IC test handlers, whose high throughput and wide range of options made them a particularly popular choice among chip manufacturers.

NS8000

Features

  1. High speed
    • These handlers are capable of transferring, testing, and sorting up to 13,500 chips per hour.
  2. Standard contact pressure sufficient for high-speed testing of high-pin-count chips
    • The standard contact force of the NS8160MS and NS8080MS is 2,400 N. So, for example, if a chip package has 500 pins, the handlers are capable of applying 30 grams of force (0.3 N) per pin and transferring, testing, and sorting 16 chips at once.
  3. Support for high temperatures
    • These handlers can test chips at temperatures as high as 155ツーC. The use of a heat press makes recovering from jams during high-temperature use easy.
  4. Support for wide socket pitches
    • A layout that accommodates wide socket pitches allows the handlers to also test large numbers of chips such as high-frequency (RF) chips, where interference between chips needs to be considered.

Main specifications

  NS8160MS NS8080MS NS8080SH
Device type QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3x3 to Max. 50x50 (Lead pitch: 0.4 mm or more) *1
Test mode 16-site (8x2) -
8-site (4x2)
Square 4-site (2x2)
In-Line 4-site (4x1)
2-site
Busy Shuttle (Single)
Testing area 264 mm x 130 mm 184 mm x 130 mm
Standard socket pitch (mm) X:30 Y:60 X:40 Y:60
Heating method Heating Plate
Index time 0.42 sec(up to 1,600 N)*2 0.4 sec(up to 1,200 N)*2
0.58 sec(up to 2,400 N)*2 -
Throughput 13,500 units
Tray classification Max. 6 classification
(3 auto loaders, 3 manual loaders)
Tray size JEDEC (135.9 x 315.0) mm
Temperature accuracy +50degC to + 90degC ±2degC
+90degC to +155degC ±3degC
Power Single phase AC 200 to 240V 50/60 Hz 6kVA
Dimension (mm) 1,860(W) x 1,500(D) x 2,000(H)*3
Weight Approx. 1,060Kg

*1 Depends on the socket size and socket pitch.
*2 Depends on the socket mounting height.
*3 Excluding the handle, tower light, and LCD monitor.


NS-8020, NS-8040, NS-8080H, NS-8080W

NS8000

Features

  1. High stability
    • Stable handling for Small packages
    • Jam Rate 1/5,000
  2. Easy operation and easy maintenance
    • Visual screen for operation
    • Easy access for changeover and Maintenance
  3. Compatible with the changeover kit for the NS-6000 series and NS-7000 series
    • Contact us for more information

Main specifications

  NS-8020 NS-8040 NS-8080H NS-8080 NS-8080W
Device type QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3x3 to Max. 50x50 (Lead pitch: 0.4 mm or more) *1
Test mode Square 4-site (2x2)
In-Line 4-site (4x1)
2-site
Busy Shuttle(Single)
8-site (4x2)
Square 4-site (2x2)
In-Line 4-site (4x1)
2-site
Busy Shuttle (Single)
Testing area 184 mm x 130 mm 184 mm x 130 mm
Standard socket pitch (mm) X:80 Y:60 X:40 Y:60 X:40 Y:60 / X:60 Y:60
Heating method Heating Plate Chamber
Index time 0.39 sec or more
(Ambient/High temperature)*2
0.36 sec or more
(Ambient/High temperature)*2
Throughput 5,400 8,000 8,300 8,300 8,200
Tray classification Max. 6 classification
(3 auto loaders, 3 manual loaders)
Max. 5 classification
(3 auto loaders, 2 manual loaders)
Tray size JEDEC (135.9 x 315.0) mm
Temperature accuracy +50degC to + 90degC ±2degC*3
+90degC to +130degC ±3degC*3
Power Single phase AC 200 to 240V 50/60 Hz 6kVA
Dimension (mm) 1,700(W) x 1,500(D) x 1,760(H)*4 1,860(W) x 1,500(D)
x 1,760(H)*4
Weight Approx. 920Kg Approx. 960Kg Approx. 1,020Kg

*1 Depends on the socket size and socket pitch.
*2 Depends on the socket mounting height.
*3 Contact us for information on NS-8080H temperature accuracy during 8-site parallel testing.
*4 Excluding the handle, tower light, and LCD monitor.


NS8160W Series

Features

  • A wide-type handler capable of testing 16 devices at once with the same basic performance as the NS-8000 series.
  • Ideal for testing memory embedded ICs, such as flash microcontrollers.

Main specifications

  NS-8160W
Device type QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3x3 to Max. 50x50 (Lead pitch: 0.4 mm or more)*1
Test mode 16-site (8x2)
8-site (4x2)
Square 4-site (2x2)
In-Line 4-site(4x1)
2-site
1-site
Testing area 260 mm x 130 mm
Standard socket pitch (mm) X:30 Y:60(16-site)
Heating method Chamber
Index time 0.40 sec or more
(Ambient/High temperature)*2
Throughput 8,300
Tray classification Max. 5 classification
(3 auto loaders, 2 manual loaders)
Tray size JEDEC (135.9 x 315.0) mm
Hot plate size 160 x 340mm 2plates(Standard)
220 x 380mm 2plates(Option)
Max. contact force 850 N(Standard) or 2,400 N(Option)
Temperature accuracy +50degC to + 90degC ±2degC
+90degC to +130degC ±3degC
Power Single phase AC 200 to 240V 50/60 Hz 6kVA
Dimension (mm) 1,860(W) x 1,500(D) x 1760(H)*3
Weight Approx. 1,040Kg

*1 Depends on the socket size and socket pitch.
*2 Depends on the socket mounting height.
*3 Excluding the handle, tower light, LCD monitor.