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September 21
News Release
---------------------------------------------------------------------------------------------------------------------------------------Epson Announces Ultra-Sensitive, Ultra-Small, 1-Chip GPS Module for Mobile Handsets
- TOKYO, Japan, September 21, 2004 -
Seiko Epson Corporation ("Epson") today announced that it has developed a single-chip global-positioning system (GPS) module whose small size and high sensitivity (-160 dBm max.) make it ideal for use in next-generation mobile handsets equipped with built-in GPS support. Samples of the new S4E19863 chips will be available beginning in October 2004.
The global market for mobile phones with built-in GPS functionality is expected to expand dramatically with the spread of position information services such as pedestrian navigation and systems for locating a user's position in the event of an emergency call. In Japan in particular, all new 3G mobile phones debuting in and after the spring of 2007 are likely to be equipped with a GPS function that enables the user's position information to be identified in the event an emergency call is placed. This likely requirement is driving demand for GPS devices that are capable of quickly and accurately identifying location anytime, anywhere. In response to this demand, Epson independently developed its own positioning algorithm and GPS chipset (which consists of a GPS baseband processor and RF receiver). Then, availing itself of a storehouse of high-density-packaging technology, Epson designed an ultra-sensitive, ultra-compact, one-chip GPS module that is capable of acquiring locations even indoors, in the shadows of tall buildings, and in other places where GPS positioning has traditionally been problematic.
The GPS module supports the three 3GPP-compliant positioning modes (MS-Based, MS-Assisted, and Autonomous), for world-class GPS positioning performance in any application and under any network environment.
Epson is committed to further serving customer needs by expanding and enhancing its line of device products that use the company's GPS and other device technologies.
S4E19863 features
· High sensitivity (-160 dBm) enables acquisition of indoor location
· High-speed satellite search algorithm
· Support for three positioning modes in compliance with the 3GPP specification
· Miniature one-chip package
General Specifications
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Product model No.
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S4E19863
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Module configuration
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GPS baseband processor + GPS RF receiver + peripheral circuitry [not including a temperature-compensated crystal oscillator
(TXCO)]
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Receiver sensitivity
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-160 dBm
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Time to first fix (TTFF)
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2 to 3 seconds (outdoors, with a hot start or server-assist)7 seconds (indoors, with a hot start or server-assist)
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Positioning accuracy
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< 10 m outdoors < 35 m indoors
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Operating voltage
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Interface voltage: 1.8V or 3.0VInternal operating voltage: 1.5V or 1.8V
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External dimensions
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13 mm x 8 mm x 1.28 mm
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About Epson
The Epson Group increases its corporate value
through its innovative and creative culture.
Dedicated to providing its customers with
digital image innovation, its main product lines
comprise information-related equipment such as
printers and projectors, electronic devices
including displays, liquid crystal panels for
projectors, semiconductors and quartz devices,
and precision products such as watches. Epson
products are known throughout the world for
their superior quality, functionality,
compactness and energy efficiency.
The Epson Group is a network of 84,899 employees
in 110 companies around the world, and is proud
of its ongoing contributions to the global
environment and to the communities in which it
is located. Led by the Japan-based Seiko Epson
Corp., which is listed on the First Section of
the Tokyo Stock Exchange, the Group had
consolidated sales of 1,413 billion yen in
fiscal 2003.
Contacts
Seiko Epson Corp.
Corporate Communications
Contact us by e-mail
http://www.epson.co.jp/
Attachment
Terminology
dBm
Decibel per milliwatt. High-frequency circuit designers often use "dBm" and "watts" to express power. A dBm is an absolute value expression where a dB is referenced to one milliwatt and where 0 dBm = 1 mW. The conversion formula is dBm = 10 log (mW), and -160 dBm is
10-16 mW.
3GPP (3rd Generation Partnership Project)
The 3rd Generation Partnership Project is a collaboration agreement put together to shape third-generation (3G) mobile communication system standards. It also refers to the standards and specifications developed by the Project for mobile communication systems. Established in December 1998, the 3GPP brings together a number of telecommunications standards bodies, including T1 (America), ETSI (Europe), ARIB and TTC (Japan), TTA (South Korea) and, later, CWTS (China).
MS-Based
Network-assisted GPS in which assist data is sent to a terminal at fixed intervals via cell broadcasts, for example. Final position calculations are performed in the handheld.
MS-Assisted
A network-assisted GPS in which final position calculations are performed by a server.
Autonomous
Positioning performed autonomously, without a network assist. All positioning calculations are performed by the handheld.
Temperature-compensated crystal oscillator (TCXO)
A crystal oscillator that has a function for compensating changes in crystal resonator frequency caused by changes in temperature.
Hot start
Refers to the state of the GPS receiving at the start of positioning. In a hot start, the receiver has valid ephemeris, almanac, time, and previous position data.
Ephemeris data
Current satellite position and timing information transmitted as part of a satellite data message. Once acquired, the information is valid for 1.5 hours. The ephemeris data is used to find the position of the satellite and calculate current position.
Almanac data
Information transmitted by each satellite on the orbits and state (health) of every satellite in the GPS constellation. Once acquired, the information is valid for one week.
TTFF
Time to first fix. The time required for a GPS receiver to output the first positioning result.
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