Seiko Epson Corporation

Introduction

The Seiko Epson Group asks its customers to approve the use of lead-free solders (mounting solders and component terminal plating^*) in products Seiko Epson supplies to those customers and further asks its component suppliers to use lead-free solders (mounting solders and component terminal plating) and to improve the heat resistance of components which Seiko Epson uses.

*Solders with high melting points and lead found in materials other than solder are not included in this definition.

This site contains Seiko Epson's Lead-Free Solder Basic Databook (with basic data relating to solder lead elimination in Seiko Epson products) and guidelines on methods to survey for lead-free status of components procured by Seiko Epson.

We ask that you understand the objectives and details of the Seiko Epson Group's effort to eliminate solder lead and give us your full support.

Lead-Free Solder Basic Databook

This databook contains basic data relating to the elimination of solder lead from products Seiko Epson supplies to its customers.

English

Japanese

Guidelines on methods to survey for lead-free status of components procured by Seiko Epson

(1) Purchased Product Solder Lead-Free Technology Data Survey and Response Guidelines (PDF) Explains how to fill out the survey form.	English (50.2KB)	Japanese (519KB)
(2) Survey form (Excel) The survey form may be downloaded.	English (384KB)	Japanese (19.2KB)